§21 — Mixed-pattern wafer data (MixedWM38) 38 wafer maps · 38 defect classes including compound patterns · statistical findings
MixedWM38 extends the WM-811K dataset with compound defect patterns — wafers labelled with two, three, or four co-occurring defect types simultaneously (e.g. Center+Edge-Ring+LOC). The dataset contains 38,015 wafer maps across 38 classes, encoded as 52×52 grids with 8 base defect types combined via multi-hot labels.

One wafer per class is loaded directly into buildWaferMap and analyzeWaferMap with no special configuration. Card labels show the MixedWM38 class name and how many statistical findings the library detected. Click on any card to open a full interactive view with the findings panel. Compound patterns often produce findings from multiple spatial families simultaneously.